The implementation of 02 special projects is of historical significance to domestic semiconductor material companies, especially equipment companies, because the amount of funds required for R&D of semiconductor equipment is huge, and if it is entirely borne by domestic companies, it may be difficult to bear the weight. The implementation of major special projects not only shows the country’s determination to support the semiconductor support industry, but also gives support to domestic companies “real money†in funding.
By undertaking the National 02 special project, the core R&D capabilities, industrialization capabilities, and industrial coordination capabilities of domestic semiconductor equipment and materials companies have been greatly improved. In the implementation of the special project of 02, equipment manufacturing companies and users have achieved a close integration of processes, which has prompted the development and manufacturing of equipment around the needs of large-scale production. The 65nm silicon etching machine of Northern Microelectronics has completed all the process assessments and certifications of SMIC's production lines, and all technical parameters have reached the level of international mainstream equipment. 65nm to 45nm copper PVD (Physical Vapor Deposition) equipment is also carried out according to the project plan node. Process testing. The 90nm to 65nm high-angle ion implanter undertaken by China Kexin entered the FAB of Beijing SMIC in October 2010. It has completed the matching test based on the 90nm process device and the small-batch test of the 90nm commercial device, and the WAT (chip acceptance test). The test data has reached the SMIC requirements and is now in the 65nm process device match test phase. The device's short-batch process test will be performed soon. China Microelectronics has developed 12-inch plasma etching equipment capable of processing 65 to 40 nanometers, and is currently processing 28 nanometer chips on the leading chip production line in Asia, two generations ahead of the original plan. Micro Media's media etching equipment has been accepted by 10 Asian chip makers' production lines and has produced more than 1.5 million qualified chips on five production lines. It can be said that domestically produced integrated circuit devices have finally taken a solid step in the road to industrialization.
Although the domestic semiconductor equipment and materials companies have achieved new breakthroughs in their core competitiveness, they must have the strength to compete with foreign well-known semiconductor equipment manufacturers that have developed for decades and have cutting-edge technologies and market connections. For manufacturers, it is not something that can be achieved overnight. In order to improve the competitiveness of domestically produced equipment, it is necessary to realize the localization of equipment for the purpose of industrialization. On the one hand, it is necessary to prioritize the use of domestic components, vigorously support domestic component manufacturers, and improve the supply chain; on the Other hand, attention should also be paid to production, research, and research. The combination of use, adhere to the enterprise as the main body, take the industrialization as the goal, and actively promote the integration of resources with a number of universities and research institutes.
Of course, the relevant state departments should further improve the implementation of major national special projects. For example, during the project review process, in addition to the participation of experts, people with experience in the international semiconductor industry, especially those in the market and finance, should also be involved to promote the 02 specialization not only to achieve breakthroughs in technology, but also in products and markets. Can make a breakthrough. For example, we should minimize the support for “sauce pepper noodlesâ€, concentrate on major issues, focus on supporting projects that can make breakthroughs, and strive to build world-class semiconductor production and support companies in the next five to ten years.
By undertaking the National 02 special project, the core R&D capabilities, industrialization capabilities, and industrial coordination capabilities of domestic semiconductor equipment and materials companies have been greatly improved. In the implementation of the special project of 02, equipment manufacturing companies and users have achieved a close integration of processes, which has prompted the development and manufacturing of equipment around the needs of large-scale production. The 65nm silicon etching machine of Northern Microelectronics has completed all the process assessments and certifications of SMIC's production lines, and all technical parameters have reached the level of international mainstream equipment. 65nm to 45nm copper PVD (Physical Vapor Deposition) equipment is also carried out according to the project plan node. Process testing. The 90nm to 65nm high-angle ion implanter undertaken by China Kexin entered the FAB of Beijing SMIC in October 2010. It has completed the matching test based on the 90nm process device and the small-batch test of the 90nm commercial device, and the WAT (chip acceptance test). The test data has reached the SMIC requirements and is now in the 65nm process device match test phase. The device's short-batch process test will be performed soon. China Microelectronics has developed 12-inch plasma etching equipment capable of processing 65 to 40 nanometers, and is currently processing 28 nanometer chips on the leading chip production line in Asia, two generations ahead of the original plan. Micro Media's media etching equipment has been accepted by 10 Asian chip makers' production lines and has produced more than 1.5 million qualified chips on five production lines. It can be said that domestically produced integrated circuit devices have finally taken a solid step in the road to industrialization.
Although the domestic semiconductor equipment and materials companies have achieved new breakthroughs in their core competitiveness, they must have the strength to compete with foreign well-known semiconductor equipment manufacturers that have developed for decades and have cutting-edge technologies and market connections. For manufacturers, it is not something that can be achieved overnight. In order to improve the competitiveness of domestically produced equipment, it is necessary to realize the localization of equipment for the purpose of industrialization. On the one hand, it is necessary to prioritize the use of domestic components, vigorously support domestic component manufacturers, and improve the supply chain; on the Other hand, attention should also be paid to production, research, and research. The combination of use, adhere to the enterprise as the main body, take the industrialization as the goal, and actively promote the integration of resources with a number of universities and research institutes.
Of course, the relevant state departments should further improve the implementation of major national special projects. For example, during the project review process, in addition to the participation of experts, people with experience in the international semiconductor industry, especially those in the market and finance, should also be involved to promote the 02 specialization not only to achieve breakthroughs in technology, but also in products and markets. Can make a breakthrough. For example, we should minimize the support for “sauce pepper noodlesâ€, concentrate on major issues, focus on supporting projects that can make breakthroughs, and strive to build world-class semiconductor production and support companies in the next five to ten years.
Henvix Lighting Technology Co., Ltd. , http://www.sz-led-light.com