Key technology of integrated circuit packaging has been broken

"100 bonders, this is not only more than 30 million output value, what's important is that this is a zero breakthrough for large orders!" Holding the sales contract just signed, the head of Beijing Zhongdianke Electronic Equipment Co., Ltd. is difficult to cover up. Excited. The company's major national special project "very large-scale integrated circuit manufacturing equipment and complete sets of technology" special (automatic wire bonding machine) passed the project acceptance at the end of last year, and received large orders from customers in the spring. This means that China has ended the long-term foreign monopoly of R&D, production, and sales of fully automatic wire bonders.

"I saw it. There is a gold wire here. The sharp trowel is using a gold wire to solder the silicon circuit to the outside pins so that the circuit on the chip can be connected." said the company's technical director. It is the first batch of domestically-manufactured "automatic wire bonding machines". Their "mission" is the key process to complete the IC packaging - gold wire bonding. On the one-meter-high desk, there is a gold wire thinner than the hair, and the gold-wire sickle is guiding the gold wire to the needle on the rice-sized chip. Do not underestimate this action, automatic identification of solder joints, alignment, ignition melting wire, pull the wire out of an arc ... ... only to weld a gold wire, wire bonders need to make 10 consecutive actions; 1 second needs to weld nearly 20 lines. This means that, with two eyes, the bonding machine has completed 200 micro-mechanical actions.

Only one-fifth of the hair is fine, and the area of ​​the silicon wafer is only the size of the millet. The demand for the fineness of operation can be imagined.

Prior to this, the global market required about 8,000 to 10,000 wire bonding machines per year, but none of them was developed and manufactured in China. At the same time, domestically, it accounts for nearly 80% of the global demand for wire bonders. Not only does it cost a lot to introduce equipment, but also parts and maintenance costs also have to pay high prices.

“The United States K&S and Singapore ASM have almost monopolized all the wire bonder markets. Because the equipment involves various technologies such as precision machinery, optics, and automatic control, the technical threshold is too high.” Say. However, the 45th Institute of China Electronics Technology Group Corporation, a controlling unit of Beijing Zhongdian University, is determined to overcome technical difficulties and undertake the task of independently developing fully automatic wire bonders. Under the leadership of Dr. Chen Wen, a member of the National “Thousand People Project” and chief expert of China Electronics Engineering Corporation, after more than 1000 days of work, more than 1,000 drawings were drawn and nearly 2 million lines of software were written. Code... At the time of making prototypes of the 5th generation, core technologies such as bond heads, large thrust linear motors, voice coil motors, transducers, optical paths, wire breakage detection, drive power, and electronic ignition were finally overcome.

At the end of last year, the company continuously operated 24 hours a day. With the imported equipment, the "PK" and the Beijing Zhongdianke automatic wire bonder, which was no less impressive, passed the verification of a number of industry customers and got a total of more than 10 small units. Order. After several months of trials to confirm the quality of performance, the first major customer finally signed 100 orders with the company in the Spring Festival. This light order accounted for about 1% of the total domestic market.