Since its inception, USB 3.0 is destined to be loved by the public, but the popularization of new technologies has always gone through a period of run-in, and there are also some non-technical human factors. The promotion of USB 3.0 is always not so smooth. .
However, the official organization still has full confidence in USB 3.0. President and Chairman of USB-IF Jeff Ravencraft said during the Intel IDF 2010: “Since last year’s announcement of the first SuperSpeed ​​USB (also known as USB 3.0) product at IDF 2009, we’ve witnessed the explosion of the (USB 3.0) ecosystem. Growth, as you know, is only a handful of USB 3.0 products that were certified a year ago, but there are now more than 120 kinds of products listed on the market. Of course, many more are waiting for certification."
The companies that enter the USB 3.0 certification family include ASUS, Buffalo, D-Link, Fujitsu, Hewlett-Packard, PLX, Texas Instruments, Samsung, Western Digital, and other manufacturers. All related products are found on motherboards, notebooks, and external storage devices. , storage controller, hard disk, PCI-E and ExpressCard expansion cards, independent chips, and other fields.
In March this year, NEC Electronics announced that it has shipped 3 million USB 3.0 controllers and will ship 20 million units as planned by the end of this year. Gigabyte also said that it shipped 1 million USB 3.0 motherboards in the first quarter of this year and will reach 5 million in the year.
However, Intel, which has mastered the USB 3.0 standard, is more optimistic about its own Light Peak fiber interface technology. For two consecutive years, IDF has displayed a high-profile demonstration platform and has largely overshadowed the popularity of USB 3.0. On the one hand, Intel has so far refused to pass the 1.0 final version of the USB 3.0 external host controller specification, which has caused widespread industry dissatisfaction with accessories and system vendors, and believes that if Intel did not intend to obstruct, related products should be shipped as early as last year.
On the other hand, Intel has repeatedly postponed the chipset's native support for USB 3.0, and it seems that it will not be implemented until at least 2011 or 2012. On IDF 2010, Dadi Perlmutter, general manager of Intel's architecture division, also declined to confirm whether the 2011 Intel chipset will support USB 3.0.
Because of this, the market adjustment agency In-Stat predicts that only after Intel and AMD chipsets provide native support in 2012, USB 3.0 devices will really take off, and shipments are expected to soar from tens of millions to 5 More than 100 million. By 2014, the entire USB product market will be close to 4.5 billion units, and USB 3.0 will be able to exceed one billion units.
However, the official organization still has full confidence in USB 3.0. President and Chairman of USB-IF Jeff Ravencraft said during the Intel IDF 2010: “Since last year’s announcement of the first SuperSpeed ​​USB (also known as USB 3.0) product at IDF 2009, we’ve witnessed the explosion of the (USB 3.0) ecosystem. Growth, as you know, is only a handful of USB 3.0 products that were certified a year ago, but there are now more than 120 kinds of products listed on the market. Of course, many more are waiting for certification."
The companies that enter the USB 3.0 certification family include ASUS, Buffalo, D-Link, Fujitsu, Hewlett-Packard, PLX, Texas Instruments, Samsung, Western Digital, and other manufacturers. All related products are found on motherboards, notebooks, and external storage devices. , storage controller, hard disk, PCI-E and ExpressCard expansion cards, independent chips, and other fields.
In March this year, NEC Electronics announced that it has shipped 3 million USB 3.0 controllers and will ship 20 million units as planned by the end of this year. Gigabyte also said that it shipped 1 million USB 3.0 motherboards in the first quarter of this year and will reach 5 million in the year.
However, Intel, which has mastered the USB 3.0 standard, is more optimistic about its own Light Peak fiber interface technology. For two consecutive years, IDF has displayed a high-profile demonstration platform and has largely overshadowed the popularity of USB 3.0. On the one hand, Intel has so far refused to pass the 1.0 final version of the USB 3.0 external host controller specification, which has caused widespread industry dissatisfaction with accessories and system vendors, and believes that if Intel did not intend to obstruct, related products should be shipped as early as last year.
On the other hand, Intel has repeatedly postponed the chipset's native support for USB 3.0, and it seems that it will not be implemented until at least 2011 or 2012. On IDF 2010, Dadi Perlmutter, general manager of Intel's architecture division, also declined to confirm whether the 2011 Intel chipset will support USB 3.0.
Because of this, the market adjustment agency In-Stat predicts that only after Intel and AMD chipsets provide native support in 2012, USB 3.0 devices will really take off, and shipments are expected to soar from tens of millions to 5 More than 100 million. By 2014, the entire USB product market will be close to 4.5 billion units, and USB 3.0 will be able to exceed one billion units.