Automakers recognize that increasing the use of in-vehicle electronic systems is the best way to deal with today's regulations and market pressures. It is predicted that by 2005, the value of automotive electronic systems will be as high as 30% of the total value of automobiles. This is a huge business opportunity for electronics manufacturers who can fully meet the needs of the automotive industry; the market needs high quality and reliable products, low cost and prompt delivery. These manufacturers themselves also have stringent requirements for manufacturing automation technology and need to work with partners to help them solve the technical and logistics challenges they face.
Versatile technology In general, automotive electronics subsystem developers have been identified as Tier One component and subsystem assembly suppliers, who now often receive assistance and support from expert partners who use advanced technology to develop innovative processes. These subsystem developers face tremendous pressure to produce higher intelligence systems at lower cost. These systems must also be lightweight, compact and functionally reliable. In addition, they often need to use cutting-edge semiconductor and assembly technology. In real-world applications, these systems must operate flawlessly throughout the extended warranty period, regardless of the unimaginable harsh environment: under the hood, in the tractor, or in the Arctic to the tropics. Driving on the body of any place. Even in the cab, the system needs to withstand shocks or vibrations, splashes of hot or carbonated beverages, temperature changes, and careless care of the careless user. These factors also contribute to the quality and integrity of the installed system. Extremely high requirements.
While automated assembly technology can help manufacturers in all electronics markets improve quality and repeatability while reducing costs, especially in the labor sector, automotive suppliers have different situations, and they need special solutions to The unique challenges it faces. This article will discuss some of the considerations specific to the automotive industry.
This article refers to the address: http://
Special Substrates Typically, ceramic substrates are used under launch covers or Other applications where the expected operating temperature varies widely, such as systems for engine control modules, because of their good thermal stability. Manufacturers considering the assembly of such modules in a straight-line automated manner have to find solutions that meet the special performance requirements of ceramic substrates; it is difficult for machine vision systems to identify fiducial marks during substrate alignment before placement of components. . It is therefore expected that the repeatability and throughput of the former will be reduced as compared with the results of assembling a "flashlight" type illuminator assembly machine with a conventional FR4 type circuit board assembly machine. Polarized illuminators can achieve better results, but Universal Instruments platforms such as the HSP (High Speed ​​Placement) or GSM series equipped with optimized multi-directional illumination matrices will significantly improve their placement performance when combined with these ceramic substrates. The ceramic substrate is more abrasive to the board transfer device than the FR4 board. Universal Instruments has developed a stainless steel kit to prevent excessive machine wear.
Multiple Mixing and Shaped Component Assembly Any line configured for assembly automotive products must be able to handle multiple mixing elements, feed them into the production line, and maintain high efficiency machine uptime. For example, a fuse box circuit board or busbar manufacturing line for the upcoming 42V power distribution system will be able to perform the following operations: press-fit terminal blades on both sides of the board; mount a small amount of SOIC, general-purpose semiconductor devices and surfaces Place 20A relay. The new line configuration may plug the terminal into the machine in combination with other machines, such as Universal Instruments' GSM platform, but planners must also consider the possible product mix and the yield and complexity of each product.
Other subsystems may require placement of large or odd-shaped components such as motor actuators, relays, or automotive-specific connectors. Its mounting requirements are subject to a wide range of automotive electronic connectors; although standardization can reduce the number of parts in the future, today's first-level assemblers may need to process thousands of part numbers to cover their customers. All connector and terminal types required.
The best solution for implementing profiled component placement depends on the number of components and whether it can be applied to standard placement platforms such as Universal Instruments' GSM flexible placement platform and whether placement can be completed within the target cycle time. Factors such as component size and feeder type, or requirements for high-speed production lines, can determine whether there is a need to add a placement machine or use a specialized profiled component assembly function. Solution providers have the ability to configure the best solution will be the best way.
Another option is Universal Instruments' new GSM Genesis machine, which can implement a full-platform solution in some cases, especially when more shaped components and large components are required, or where small or medium-volume production is required. Currently, GSM Genesis machines are suitable for manufacturing cycle rates of 20,000 to 40000 cph, and future improvements will make GSM Genesis faster, but Universal Instruments' HSP series of high-speed placement machines are the best solution for higher cycle rate applications. .
In addition, driver and passenger information systems such as radio/CD players, GPS navigation or integrated communication/multimedia systems may present the same challenges, and will require more than other systems such as 42V power distribution modules or engine controllers. A large number of components. The challenge here is to combine high-speed placement with flexible precision placement capabilities to optimize production capacity and reduce equipment asset costs.
Final Assembly of the Chassis Most automotive electronics subsystems, particularly those for engine control, ABS, power steering, traction control and other functions, are housed in heat-resistant, waterproof, anti-condensation or anti-vibration enclosures. In order to facilitate control and quality assurance, even if the labor costs are low, the assembly of these casings is fully automated. Reconfigurable assembly solutions, such as Universal's Polaris multi-process assembly unit, provide cost-effective and flexible manufacturing methods to meet many final assembly requirements.
This is an improved version of the Polaris servo-clamping unit designed for profiled component placement with a standard tool interface that allows multiple tool accessories to be interchanged for a variety of final assembly functions, including assembly of the housing, Apply sealant or mounting glue, visual inspection, screwing, and many other features. For outsourced service providers or any product assembler who needs to produce highly mixed products, the production is relatively low, or the need to redistribute the production line to fulfill special contracts, this will be a powerful choice.
Availability Any manufacturer that expects an order in the automotive industry must have effective component and board-level availability. This applies primarily to safety-critical systems such as anti-lock brakes and traction control, as well as secondary safety equipment such as airbags. These systems can be very complex and versatile; for example, a comprehensive airbag controller will include airbag opening, airflow control, pre-crash detection, passenger detection, roll detection and acceleration detection. These systems are almost standard on today's new cars, and new safety measures will continue to emerge, including those for pedestrian protection in car accidents.
But availability is not limited to the safety performance of in-vehicle electronic systems. Car radio, navigation, telematics, and cellular telephone systems, although not considered a critical safety factor, do not guarantee that products will not be returned and generate significant expenditures; defective parts or defects that may be defective Parts cannot be inspected and assembled into the system. This also applies to high-speed Internet systems that enter high-end commercial vehicles.
Universal Instruments' Dimensions Manufacturing Automation Software Suite includes features designed to simplify usability. The Dimensions Manufacturing Monitoring Module (DDM) supports component and board-level bar code tracking. By querying the SQL database based on the defective component date code, you can find the board with the defective component. The ability to quickly detect and identify defective components prevents products with potential defects from leaving the factory. This low-cost option can bring huge returns because the cost of using the return-to-product mechanism can be much higher than the price of the entire assembly line.
Logistics For manufacturers at all levels of the automotive industry, cost and efficiency are key to survival. In order to work with customers and suppliers, electronic manufacturers must adopt a streamlined manufacturing strategy.
According to a study by the University of Michigan, automakers can reduce company inventory by up to 60% and transaction costs by up to 75% by automating the replenishment process within the supply chain. To this end, manufacturers throughout the automotive industry, including electronics manufacturers, are using third-party supply chain software to integrate a variety of standard business modules, including receivables, accounts payable, general ledger and purchases. Universal's Dimensions software can be easily used with these solutions. For example, the Dimensions Logistics Module (DLM) allows corporate management to read plant floor information such as inventory information on used and active components of the production line, as well as the location of feeders and stocks in the shop. This is real-time data that reflects real-world consumable information and can be used by enterprise management systems to more effectively improve procurement operations and manage inventory.
Future Convergence The market for automotive electrical and electronic subsystems has grown since the vehicle began to deploy car radios, power windows and central locking systems. Today, there is a huge space for the development and establishment of automotive electronic systems. The goal is to make cars more manageable, suitable for sale, safer and more convenient for monitoring by the road administration. Some examples of emerging technologies include wired driving and x-by-wire systems, telematics, advanced automatic transmission, lane departure warning, collision detection and avoidance, and intelligent vehicle number plates; Full electronic passenger vehicle system.
As a result, automakers demand that subsystem suppliers offer price and logistics services such as consumer electronics, combined with advanced technologies similar to aerospace and medical – high reliability and component-level availability.
To meet this integration requirement, the production line needs to be highly automated, capable of mounting various types and specifications of components, and with high flexibility to meet the requirements of larger production volumes and product mixes. First-tier suppliers and new automotive technology experts have found that working with automotive manufacturing experts can benefit from the ability to deploy the best solutions from a variety of platforms to achieve high-speed, flexible and sophisticated electronics manufacturing capabilities. .
Ceramic element(External drive)
piezo ceramic disc,piezo ceramic manufacture,ultrasonic ceramic disc
SWT Smart Technology Co., Ltd. , http://www.fuding-sound.com