Infineon introduces automotive-quality power modules with high power density and high reliability

Nubia and Nuremberg, Germany, July 9, 2013 -In the PCIM Europe 2013 in Nuremberg (May 14-16, 2013), Infineon Technologies Co., Ltd. (FSE: IFX / OTCQX: IFNNY ) Launch of the new EconoDUAL â„¢ 3 IGBT module that fully complies with automotive standards. This new product can meet the demanding applications of commercial vehicles, engineering vehicles, agricultural vehicles and other reliability requirements. Automotive grade quality means that the module can significantly increase the temperature cycle and thermal shock resistance, and uses a new soft characteristic diode that can improve EMI characteristics.

Zhang Xi, Manager of Technology and Product Marketing Department of Infineon Technology Co., Ltd., said: "This product that fully complies with automotive standards is an extension of the high-quality EconoDUAL â„¢ 3 series, which is Infineon's development, manufacturing and processing of IGBT modules. And the realization of more than ten years of experience in implementing specific automotive requirements. In addition, reliability has been significantly improved, and it can fully meet even the most stringent standards for the most demanding applications. "

The new automotive-grade quality module EconoDUAL â„¢ optimizes the design and improves the production process technology. Compared with industry standards, its temperature cycle ability is three times higher and its thermal shock resistance is ten times higher. With excellent mechanical strength and power cycling capabilities, and PressFIT crimping PressFit pins, Infineon provides a reliable, cost-effective solution for a variety of automotive applications.

EconoDUAL â„¢ 3 series modules achieve the highest power density (up to 600A / 1200V) on their limited baseplate size. The module has excellent switching characteristics, and copper wire bonding reduces internal lead resistance. Due to the use of copper bonding technology and improved DCB, compared with the related 450A version, its output power can be increased by up to 30%.

In order to facilitate logistics and product tracking, all Infineon IGBT modules have a unique and complete label. The new EconoDUAL â„¢ 3 module uses a chip with DMX code, which can automatically identify the assembled device and enhance traceability.

Supply

The samples FF400R12ME4A_B11 (400A, 1200V) and FF600R12ME4A_B11 (600A, 1200V) of the automotive-grade quality module EconoDUAL â„¢ 3 will be available in the fourth quarter of 2013 and mass production will begin in the second half of 2014. For more information about EconoDUAL â„¢ 3 modules and EconoDUAL product series, please visit.

About Infineon

Infineon Technologies AG, headquartered in Neubiberg, Germany, provides semiconductor and system solutions for the three major scientific and technological challenge areas of modern society—energy efficiency, mobility, and security. In fiscal year 2012 (as of September 30), the company achieved sales of 3.9 billion euros and had approximately 26,700 employees worldwide. Infineon is currently listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and the U.S. over-the-counter market (OTCQX) InternaTIonal Premier (stock code: IFNNY).

Infineon in China

Infineon Technologies AG officially entered the Chinese market in 1995. Since the establishment of the first company in Wuxi in 1996, Infineon's business has achieved very rapid growth. With more than 1,300 employees in China, it has become an important driving force for the development of Infineon's Asia-Pacific and global businesses. Infineon has established a complete industrial chain covering R & D, production, sales, marketing, technical support, etc. in China, and has carried out in-depth cooperation with domestic leading companies and universities in sales, technical research and development, and personnel training. Cooperation.

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